Increased Component Density
Cost Reduction
We now assemble thousands of 0201 (Imperial) components daily and are already prepared to assemble and inspect 01005 (Imperial) components, having completed all reliability tests and validated the process.
BGA, CBGA, uBGA, and QFN are terms regularly used by SMD operators and inspectors. The resolution of SMD assembly is crucial for ensuring precision, reliability, and miniaturization in modern electronic devices, especially with the increasing use of smaller and more complex components.
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